Main applications
BGA void position, defect of small electronic parts.
Solder pole
aluminum die cast
BGA
Constitution
item | Classification | Contents |
---|---|---|
Work rotating part | Rotation mechanism | Adjustable turning axis angle by gonio stage |
Rotary motor and driver included | ||
Calibration jig/td> | Removable | |
Work fixing jig | For board parts, small parts such as capacitors | |
Personal computer | PC specification | Windows xp sp2;7 IntelCore2Duo;1.86GHZ,2Gib RAM |
Network equipment | High speed hub for data transfer with inspection equipment PC | |
Software for CT | Image reconstruction program and image display / rendering | CT reconstruction integrated software TomoShop |
Rotating section control | Work rotation and image input software (manufactured by SOFTEX) |
specification
item | Classification | Contents |
---|---|---|
Inspection work size | SMT · PCB board | 50×100×2mm |
Small electronic components (capacitors, etc.) | φ5mm~10mm、h=5mm~20mm | |
Maximum rotating mechanism weight | Approximately 100g | |
Image composition time | Image Projection 400frame Image Projection 400 frame Number of integrations 16 |
About 3 minutes 20 seconds |
Image Projection 900frame Number of integrations 16 |
About 7 minutes 30 seconds | |
Image Projection 1200frame Number of integrations 16 |
About 11 minutes and 00 second | |
Additional Conditions: Depends on case when using 1 million pixel X-ray camera | ||
CT reconstruction / calculation function | XYZ 3 direction | CT reconstruction integrated software by TomoShop rendering function |
Rotary axis correction function | Correction by TomoShop focusing function | |
Image reconstruction tact time | Within about 10 seconds |