Main applications
Solder joint condition, micro crack inspection, resin fiber flow, void, capacitor winding state, disconnection state of IC wire, cable etc.
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BGA
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IC wire
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Cap fitting
specification
TYPE | SFX-90 | SFX-100 | SFX-130 | SFX-150 | SFX-160G |
---|---|---|---|---|---|
input | AC100V,50/60Hz | ||||
Maximum voltage | 90kV | 100kV | 130kV | 150kV | 160kV |
Maximum current | 0.2mA | 0.25mA | 0.3mA | 0.5mA | 0.2mA |
Detector | High resolution X-ray II camera system (1.0 Mpix digital CCD) | ||||
Table size | 250×330mm | ||||
Appearance dimension | W750×D1,100×H1,950mm | W1,100× D1,250×H1,950mm |
W950× D1,450×H1,615mm |
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Equipment weight | About 950kg | About 1,100kg | About 1,300kg | About 1,650kg |
*Table size 400 x 400, 400 x 600 can also be changed.
*Roll system, camera tilt, CT retrofit option, and many others.
*External dimensions and weight vary depending on specifications.